Brian Wu
Hukou Operation Center, Vice President at Chipbond Technology Corporation.
Others working in Chipbond Technology Corporation.
John Espallardo
Chief Process Engineer (WLCSP Wet Clean -Strip, Etch, Ball Placement) at Chipbond Technology Corporation.
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Roger Lo
Senior Chief Engineer at Chipbond Technology Corporation.
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Shane Lin
人力資源資深管理師 Human Resource Chief Officer at Chipbond Technology Corporation.
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Tu Jiarong
Assistant Vice President at Chipbond Technology Corporation.
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